Dis Assembling Of Mobile

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kssinfotech ...WORK STATION 5. TRIGGERING OF BATTERIES 6. ASSEMBLING & DIS ASSEMBLING OF MOBILE PHONES 7. CHIP LEVEL SERVICING OF COMPONENTS : POWER AMPLIFIERS(PF), AUDIO IC(COBBA), CPU (MAD),POWERSUPPLY IC (CONT), CHARGING CONTROL IC (CHAPS).RF SIGNAL PROCESSOR IC( HAGAR) . ALSO well versed with SMD components replacement (capactiors, Diodes Resistors, LEDs).REBALLING more...
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