Advanced Workmanship Standards and Instruction for the Soldering & Rework of Through-Hole and Surface Mount Components.
IPC Standards
Training
Provided by Precision PCB Services, Inc.
SR200 is a one day course for students that have basic to advanced hand soldering skills. This course is excellent to learn new soldering techniques and introduces the student to a variety of tools, equipment and solder tips for component installation and removal.
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Advanced Workmanship Standards and Instruction for the Soldering & Rework of Through-Hole and Surface Mount Components.
Course Description:
An 8 hour hands on session. Course content covers Through-Hole and Surface Mount Technologies including fine pitch. Students will learn techniques for the installation and removal of through-hole and surface mount components and how to properly evaluate solder joints. The course utilizes Metcal and Pace Solder & Desolder Stations, using a variety of different style tips for installation and removal of components. Also an excellent course to help you evaluate the different brands and types of equipment before you purchase them.
An 8 hour hands on session. Course content covers Through-Hole and Surface Mount Technologies including fine pitch. Students will learn techniques for the installation and removal of through-hole and surface mount components and how to properly evaluate solder joints. The course utilizes Metcal and Pace Solder & Desolder Stations, using a variety of different style tips for installation and removal of components. Also an excellent course to help you evaluate the different brands and types of equipment before you purchase them.
About The Training Provider: Precision PCB Services, Inc.
Precision PCB Services, Inc. - Precision PCB Services, Inc. provides services, training and consulting to electronic contract manufacturers and product development companies.
We offer a variety of courses & certification for the assembly, rework and repair of printed circuit boards. We provide consulting services in relation to Lead Free and BGA Process Implementation, defect analysis, and quality improvement.
